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Amkor Technology - Unitive - CSP Wafer Level Packaging WLP, Flip Chip BGA, Laminate Package
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| Stock Symbol AMKR
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1900 South Price Rd
Chandler, AZ (USA) 85248
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| Phone: |
480 821 5000 |
| Fax: |
480 821 8276 |
| Company Description |
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Amkor $2.8 Billion sales, semiconductor fab subcontractor packaging, assembly test services, BGA ceramic ball grid array package, CMOS camera image sensor, game memory cards, WL-CSP chip scale package, flip chip, 3D stacked die, dual package |
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