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Cool Innovations
   

  344 Edgeley Blvd #25
  Concord, Ontario (Canada) ONL-4B7
   
  Phone:  905.760.1992
  Fax:  905.760.1994

  www.coolinnovations.com


Company Description
Cool Innovations heat sinks for surface mount devices (SMD) & through-hole devices. Cool Innovations aluminum pin or copper pin heat sinks. Computer Intel CPU heat sinks. Power module heat sinks. Power amplifier heat sinks.
 

Heat Sinks for

  • Surface Mount Devices

  • Through-Hole Devices

  • CPUs

  • Power Modules

  • Power Amplifiers

 

Incorporated in 1996, Cool Innovations is a privately owned provider of thermal management solutions. The company's core competencies lie in the design and manufacturing of pin fin heat sinks. Cool Innovations' pin fin product offerings provide outstanding cooling solutions for a variety of applications and industries. From board level up to system level and from the telecommunications and defense industries to medical equipment and consumer electronics, Cool Innovations can accommodate widely varied cooling needs.

Cool Innovations is dedicated to continuous investment in research and development, so as to generate increasingly creative and powerful cooling solutions. The UltraCool IV heat sink line - the first comprehensive copper pin fin heat sink line - serves as evidence for this commitment to innovation.


Thermal Characteristics

UltraCool heat sinks provide extremely efficient cooling solutions. The omni-directional pin fin structure, the round nature of the pins and the use of highly conductive materials combine to produce compact, yet powerful cooling solutions.


The omni-directional structure allows air to penetrate and exhaust the heat sink from every possible direction. As a result, it is easy for air to enter and leave the pin structure, providing an efficient cooling scheme. Keeping all relevant variables constant, omni-directional heat sinks outperform bi-directional heat sinks by approximately twenty percent. The round nature of the pins creates turbulence within the heat sink. Turbulent air breaks the stagnant air boundary layers around the pins and as a result enhances the heat sink's thermal performance. In addition, the round pin structure exposes a large percentage of the surface area to incoming airflows and at the same time does not present an extreme pressure resistance to the airflow.


UltraCool heat sinks are manufactured out of highly conductive materials. Forged UltraCool III heat sinks are manufactured out of pure aluminum (Al 1100) and UltraCool IV heat sinks are composed of the highly thermally conductive oxygen free copper. When compared to AL380, a common casting alloy, AL1100 provides a 45 percent conductivity premium.

Pin Fin Optimization

Through the control of pin density, UltraCool heat sinks can be optimized for different airflows. In environments that possess high-speed air, a highly dense pin configuration is recommended, and in environments that possess low-speed air and in natural convection a low pin density is recommended. Consequently, the highly dense UltraCool "R" pin configuration is recommended for environments that possess high air speeds and UltraCool "M" and UltraCool "U" pin configurations are recommended for environments that possess low-speed air and for natural convection.

Customization

The pin fin technology allows for a high degree of customization. Essentially all of the heat sink's parameters are variable. Customizable parameters include overall height, pin height, base thickness, footprint, pin diameter and pin density. At the same time, Cool Innovations' manufacturing technology enables the design of uniquely shaped heat sinks for specific applications. Unique designs include heat sinks with stepped base plates, round heat sinks, U-shaped heat sinks and heat sinks in which pins are skipped due to space constraints.

   
Products / Services
Heat Sinks, Computer CPU